TY - GEN
T1 - Reliability analysis of solderless press-fit interconnections
AU - Tohmyoh, Hironori
AU - Yamanobe, Kiichiro
AU - Saka, Masumi
AU - Utsunomiya, Jiro
AU - Nakamura, Takeshi
AU - Nakano, Yoshikatsu
PY - 2007
Y1 - 2007
N2 - This paper treats typical mechanical problems met in a solderless press-fit assembly. First, the elastic-plastic properties of a pin and the friction coefficient of the pin in thin plated through hole (TH) are determined by the experiments and the three-dimensional finite element (FE) analysis. The elasticplastic properties of the press-fit pin are determined by the small scale three-point bending. The friction coefficient of the pin in the TH is successfully determined from the load-displacement relationship of the pin during press-fit assembly. The validity of the determined parameters is to be clarified by conducting the press-fit assemblies into the holes with different diameters. By comparing the damaged area of the printed circuit boards after assembly and the stress distributions obtained numerically, the failure stress of the board is determined. Finally, both the retention force of the pin and the damage of the printed circuit board after assembly become possible to be predicted by the numerical analysis.
AB - This paper treats typical mechanical problems met in a solderless press-fit assembly. First, the elastic-plastic properties of a pin and the friction coefficient of the pin in thin plated through hole (TH) are determined by the experiments and the three-dimensional finite element (FE) analysis. The elasticplastic properties of the press-fit pin are determined by the small scale three-point bending. The friction coefficient of the pin in the TH is successfully determined from the load-displacement relationship of the pin during press-fit assembly. The validity of the determined parameters is to be clarified by conducting the press-fit assemblies into the holes with different diameters. By comparing the damaged area of the printed circuit boards after assembly and the stress distributions obtained numerically, the failure stress of the board is determined. Finally, both the retention force of the pin and the damage of the printed circuit board after assembly become possible to be predicted by the numerical analysis.
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U2 - 10.1115/IPACK2007-33264
DO - 10.1115/IPACK2007-33264
M3 - Conference contribution
AN - SCOPUS:40449139551
SN - 0791842770
SN - 9780791842775
T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
SP - 611
EP - 615
BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
T2 - ASME Electronic and Photonics Packaging Division
Y2 - 8 July 2007 through 12 July 2007
ER -