RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

Mona J K Klein; Takahito Ono; Masayoshi Esashi; J. G. Korvink

RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

Mona J K Klein, Takahito Ono, Masayoshi Esashi, J. G. Korvink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.

Original language	English
Title of host publication	Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages	345-348
Number of pages	4
Publication status	Published - 2007 Dec 1
Event	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan Duration: 2007 Jan 21 → 2007 Jan 25

Other

Other	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Country/Territory	Japan
City	Kobe
Period	07/1/21 → 07/1/25

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

Cite this

RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI. / Klein, Mona J K; Ono, Takahito; Esashi, Masayoshi et al.
Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007. 2007. p. 345-348 4433106.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Klein, MJK, Ono, T, Esashi, M & Korvink, JG 2007, RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI. in Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007., 4433106, pp. 345-348, 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007, Kobe, Japan, 07/1/21.

@inproceedings{3ba044c839ca41368e5f3a25f9de44a4,

title = "RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI",

abstract = "We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.",

author = "Klein, {Mona J K} and Takahito Ono and Masayoshi Esashi and Korvink, {J. G.}",

year = "2007",

month = dec,

day = "1",

language = "English",

isbn = "1424409519",

pages = "345--348",

booktitle = "Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007",

note = "20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 ; Conference date: 21-01-2007 Through 25-01-2007",

}

TY - GEN

T1 - RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

AU - Klein, Mona J K

AU - Ono, Takahito

AU - Esashi, Masayoshi

AU - Korvink, J. G.

PY - 2007/12/1

Y1 - 2007/12/1

N2 - We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.

AB - We report the fabrication of a solenoidal microcoil mould structure based on reactive ion etching (RIE) of 100 μm thick borosilicate glass wafers. For magnetic resonance imaging (MRI), glass has superior properties compared to silicon, e.g. the lower dielectric constant and transparency. Double-side polished substrates are pre-etched in a two step process, and then anodically bonded together to achieve a hollow structure inside the coil to serve as a sample container. Two additional etch steps that are each performed on the top and bottom surfaces of the bonded wafers complete the solenoidal coil mould structure.

UR - http://www.scopus.com/inward/record.url?scp=52249108464&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=52249108464&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:52249108464

SN - 1424409519

SN - 9781424409518

SP - 345

EP - 348

BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007

T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007

Y2 - 21 January 2007 through 25 January 2007

ER -

RIE of solenoidal microcoil glass mould with integrated sample container for Micro-MRI

Abstract

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this