Room temperature bonding of wafers in air using Au-Ag alloy films

H. Kon; M. Uomoto; T. Shimatsu

doi:10.1109/LTB-3D.2014.6886167

Room temperature bonding of wafers in air using Au-Ag alloy films

H. Kon, M. Uomoto, T. Shimatsu

Advanced Interdisciplinary Research Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Room temperature bonding of wafers in air using Au-Ag alloy films was studied. Experimental results show that the bonding using Au-Ag alloy films containing Ag content up to 70-80 at% shows almost equal bonding performance in air to that obtained using Au films.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886167
Publication status	Published - 2014 Jan 1
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Publication series

Name	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/Territory	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

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10.1109/LTB-3D.2014.6886167

Cite this

Kon, H., Uomoto, M., & Shimatsu, T. (2014). Room temperature bonding of wafers in air using Au-Ag alloy films. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886167] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886167

Room temperature bonding of wafers in air using Au-Ag alloy films. / Kon, H.; Uomoto, M.; Shimatsu, T.

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. 6886167 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kon, H, Uomoto, M & Shimatsu, T 2014, Room temperature bonding of wafers in air using Au-Ag alloy films. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886167, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886167

Kon H, Uomoto M, Shimatsu T. Room temperature bonding of wafers in air using Au-Ag alloy films. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. 6886167. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). doi: 10.1109/LTB-3D.2014.6886167

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title = "Room temperature bonding of wafers in air using Au-Ag alloy films",

abstract = "Room temperature bonding of wafers in air using Au-Ag alloy films was studied. Experimental results show that the bonding using Au-Ag alloy films containing Ag content up to 70-80 at% shows almost equal bonding performance in air to that obtained using Au films.",

author = "H. Kon and M. Uomoto and T. Shimatsu",

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Room temperature bonding of wafers in air using Au-Ag alloy films

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