TY - GEN
T1 - Room temperature vacuum sealing using surfaced activated bonding with Au thin films
AU - Okada, Hironao
AU - Itoh, Toshihiro
AU - Frömel, Jörg
AU - Gessner, Thomas
AU - Suga, Tadatomo
PY - 2005
Y1 - 2005
N2 - We report the surface activated bonding (SAB) through Au thin films with the thickness of a few tens of nanometers can be applied to room temperature vacuum sealing for microelectromechanical systems (MEMS) packaging. In previous study, it was found that room temperature bonding of Si/Si and Si/chemical mechanical polished (CMP) electroplated Cu could be successfully applied to vacuum sealing of micro cavities. However this method needs high vacuum in bonding process for keeping activated surfaces and the surfaces should be cleaned by wet processes. In this study we attempt to realize room temperature vacuum sealing in low vacuum without any wet surface pre-treatments utilizing Au thin films with controlled surface roughness. We propose and develop packaging structures with comb-drive resonators for characterization of sealing quality and show the applicability of SAB of Au-Au thin films to vacuum-seal packaging.
AB - We report the surface activated bonding (SAB) through Au thin films with the thickness of a few tens of nanometers can be applied to room temperature vacuum sealing for microelectromechanical systems (MEMS) packaging. In previous study, it was found that room temperature bonding of Si/Si and Si/chemical mechanical polished (CMP) electroplated Cu could be successfully applied to vacuum sealing of micro cavities. However this method needs high vacuum in bonding process for keeping activated surfaces and the surfaces should be cleaned by wet processes. In this study we attempt to realize room temperature vacuum sealing in low vacuum without any wet surface pre-treatments utilizing Au thin films with controlled surface roughness. We propose and develop packaging structures with comb-drive resonators for characterization of sealing quality and show the applicability of SAB of Au-Au thin films to vacuum-seal packaging.
KW - Au thin film
KW - Comb-drive resonator
KW - Microelectromechanical systems (MEMS)
KW - Surface activated bonding (SAB)
KW - Vacuum sealing
UR - http://www.scopus.com/inward/record.url?scp=27544509464&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=27544509464&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2005.1496571
DO - 10.1109/SENSOR.2005.1496571
M3 - Conference contribution
AN - SCOPUS:27544509464
SN - 0780389948
SN - 9780780389946
T3 - Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
SP - 932
EP - 935
BT - TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
T2 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Y2 - 5 June 2005 through 9 June 2005
ER -