Ru Alloy-Oxide Buffer Layer for Intergranular Exchange Decoupling of CoPt-B2O3 Granular Media

Kim Kong Tham; Ryosuke Kushibiki; Tomonari Kamada; Shintaro Hinata; Shin Saito

doi:10.1109/TMAG.2017.2749433

Ru Alloy-Oxide Buffer Layer for Intergranular Exchange Decoupling of CoPt-B₂O₃ Granular Media

Kim Kong Tham, Ryosuke Kushibiki, Tomonari Kamada, Shintaro Hinata, Shin Saito

ENG - Electronic Engineering

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Investigation of magnetic properties and microstructure for the Co₈₀Pt₂₀-30vol% B₂O₃ granular medium to clarify the effect of utilizing buffer layer (BL) on intergranular exchange coupling was conducted. It was found that the employment of a Ru₅₀Co₂₅Cr₂₅-30vol% TiO₂ BL with thickness of around 2 nm will avoid physical contact between magnetic grains in the initial growth region, which is effective to intergranular exchange decouple the magnetic grains. On the other hand, for deposition of BL thicker than 2 nm, underlayer will be flatten that brings the possibility of physical contact of magnetic grains and forms a granular film with strong intergranular exchange coupling.

Original language	English
Article number	8026181
Journal	IEEE Transactions on Magnetics
Volume	54
Issue number	2
DOIs	https://doi.org/10.1109/TMAG.2017.2749433
Publication status	Published - 2018 Feb

Keywords

CoPt-BO granular media
RuCoCr-TiO buffer layer (BL)
high Hc
intergranular exchange coupling

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/TMAG.2017.2749433

Cite this

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title = "Ru Alloy-Oxide Buffer Layer for Intergranular Exchange Decoupling of CoPt-B2O3 Granular Media",

abstract = "Investigation of magnetic properties and microstructure for the Co80Pt20-30vol% B2O3 granular medium to clarify the effect of utilizing buffer layer (BL) on intergranular exchange coupling was conducted. It was found that the employment of a Ru50Co25Cr25-30vol% TiO2 BL with thickness of around 2 nm will avoid physical contact between magnetic grains in the initial growth region, which is effective to intergranular exchange decouple the magnetic grains. On the other hand, for deposition of BL thicker than 2 nm, underlayer will be flatten that brings the possibility of physical contact of magnetic grains and forms a granular film with strong intergranular exchange coupling.",

keywords = "CoPt-BO granular media, RuCoCr-TiO buffer layer (BL), high Hc, intergranular exchange coupling",

author = "Tham, {Kim Kong} and Ryosuke Kushibiki and Tomonari Kamada and Shintaro Hinata and Shin Saito",

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T1 - Ru Alloy-Oxide Buffer Layer for Intergranular Exchange Decoupling of CoPt-B2O3 Granular Media

AU - Tham, Kim Kong

AU - Kushibiki, Ryosuke

AU - Kamada, Tomonari

AU - Hinata, Shintaro

AU - Saito, Shin

PY - 2018/2

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N2 - Investigation of magnetic properties and microstructure for the Co80Pt20-30vol% B2O3 granular medium to clarify the effect of utilizing buffer layer (BL) on intergranular exchange coupling was conducted. It was found that the employment of a Ru50Co25Cr25-30vol% TiO2 BL with thickness of around 2 nm will avoid physical contact between magnetic grains in the initial growth region, which is effective to intergranular exchange decouple the magnetic grains. On the other hand, for deposition of BL thicker than 2 nm, underlayer will be flatten that brings the possibility of physical contact of magnetic grains and forms a granular film with strong intergranular exchange coupling.

AB - Investigation of magnetic properties and microstructure for the Co80Pt20-30vol% B2O3 granular medium to clarify the effect of utilizing buffer layer (BL) on intergranular exchange coupling was conducted. It was found that the employment of a Ru50Co25Cr25-30vol% TiO2 BL with thickness of around 2 nm will avoid physical contact between magnetic grains in the initial growth region, which is effective to intergranular exchange decouple the magnetic grains. On the other hand, for deposition of BL thicker than 2 nm, underlayer will be flatten that brings the possibility of physical contact of magnetic grains and forms a granular film with strong intergranular exchange coupling.

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