TY - GEN
T1 - ScAlN Lamb wave resonator in GHz range released by XeF2 etching
AU - Konno, Akira
AU - Sumisaka, Masahiro
AU - Teshigahara, Akihiko
AU - Kano, Kazuhiko
AU - Hashimo, Ken Ya
AU - Hirano, Hideki
AU - Esashi, Masayoshi
AU - Kadota, Michio
AU - Tanaka, Shuji
PY - 2013
Y1 - 2013
N2 - Recently, it was reported that the piezoelectric characteristic of AlN was enhanced by doping Sc, and that 40% Sc-doped AlN (Sc0.4Al 0.6N) had approximately 5 times higher piezoelectricity than pure AlN. In this study, we designed, fabricated and evaluated Lamb wave resonators using a Sc0.4Al0.6N thin film. First, we examined elastic constants c44E and c44D of Sc 0.4Al0.6N using a thickness-shear wave resonator excited by parallel electric field, and then designed Lamb wave resonators using revised material constants. The Lamb wave resonators were fabricated by electron beam lithography, reactive ion etching, XeF2 release etching etc. The maximum and average electromechanical coupling coefficients were 8.3% and 6.8%, respectively, for 2.6 GHz devices working in S0 mode.
AB - Recently, it was reported that the piezoelectric characteristic of AlN was enhanced by doping Sc, and that 40% Sc-doped AlN (Sc0.4Al 0.6N) had approximately 5 times higher piezoelectricity than pure AlN. In this study, we designed, fabricated and evaluated Lamb wave resonators using a Sc0.4Al0.6N thin film. First, we examined elastic constants c44E and c44D of Sc 0.4Al0.6N using a thickness-shear wave resonator excited by parallel electric field, and then designed Lamb wave resonators using revised material constants. The Lamb wave resonators were fabricated by electron beam lithography, reactive ion etching, XeF2 release etching etc. The maximum and average electromechanical coupling coefficients were 8.3% and 6.8%, respectively, for 2.6 GHz devices working in S0 mode.
KW - Lamb wave
KW - Micro Electro Mechanical Systems (MEMS)
KW - Resonator
KW - ScAlN
UR - http://www.scopus.com/inward/record.url?scp=84894337130&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894337130&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2013.0350
DO - 10.1109/ULTSYM.2013.0350
M3 - Conference contribution
AN - SCOPUS:84894337130
SN - 9781467356862
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 1378
EP - 1381
BT - 2013 IEEE International Ultrasonics Symposium, IUS 2013
T2 - 2013 IEEE International Ultrasonics Symposium, IUS 2013
Y2 - 21 July 2013 through 25 July 2013
ER -