Self-assembly technologies for FlexTrate™

Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Citations (Scopus)


We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Print)9781538649985
Publication statusPublished - 2018 Aug 7
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 2018 May 292018 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference68th IEEE Electronic Components and Technology Conference, ECTC 2018
Country/TerritoryUnited States
CitySan Diego


  • Capillary Self-Assembly
  • Flexible Hybrid Electronics (FHE)
  • Heterogeneous Integration
  • PDMS


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