TY - GEN
T1 - Shear strength of room-temperature-bonded sapphire and metal substrates using Au films
AU - Kon, H.
AU - Uomoto, M.
AU - Nakajima, N.
AU - Nakaya, T.
AU - Shimatsu, T.
N1 - Publisher Copyright:
© 2017 JSPS 191st Committee on Innovative Interface Bonding Technology.
PY - 2017/6/13
Y1 - 2017/6/13
N2 - For sapphire and various metals (Al alloys, Cu alloys, and stainless steel) bonded at room temperature using Au films, shear strength was assessed in this study. Results show extremely high shear strength of all samples: Greater than 10 kN (50 MPa).
AB - For sapphire and various metals (Al alloys, Cu alloys, and stainless steel) bonded at room temperature using Au films, shear strength was assessed in this study. Results show extremely high shear strength of all samples: Greater than 10 kN (50 MPa).
UR - http://www.scopus.com/inward/record.url?scp=85022178772&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85022178772&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2017.7947444
DO - 10.23919/LTB-3D.2017.7947444
M3 - Conference contribution
AN - SCOPUS:85022178772
T3 - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
SP - 48
BT - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Y2 - 16 May 2017 through 18 May 2017
ER -