TY - JOUR
T1 - Silicon carbide surface micromachining technology by tetramethylsilane- based atmospheric vapor deposition
AU - Hatakeyama, Y.
AU - Esashi, M.
AU - Tanaka, S.
PY - 2009
Y1 - 2009
N2 - Systematic study on selective silicon carbide (SiC) deposition on SiN, SiO 2 and Si was performed. Poly-SiC was deposited by atmospheric pressure vapor deposition (APCVD) using tetramethylsilane (TMS), which allows easy handling and low temperature deposition. We found a process condition enabling the selective SiC deposition as well as a design guideline for SiC surface micromachining based on the selective SiC deposition. If both process condition and design guideline are used, continuous fine-grained SiC films are deposited on SiN and Si, while SiC islands are deposited on Sio 2. SiC films on SiN are used as the microstructures, and SiC islands on SiO 2 are lifted off by SiO 2 sacrificial etching. Finally, movable SiC microstructures were fabricated by the developed surface micromachining technology.
AB - Systematic study on selective silicon carbide (SiC) deposition on SiN, SiO 2 and Si was performed. Poly-SiC was deposited by atmospheric pressure vapor deposition (APCVD) using tetramethylsilane (TMS), which allows easy handling and low temperature deposition. We found a process condition enabling the selective SiC deposition as well as a design guideline for SiC surface micromachining based on the selective SiC deposition. If both process condition and design guideline are used, continuous fine-grained SiC films are deposited on SiN and Si, while SiC islands are deposited on Sio 2. SiC films on SiN are used as the microstructures, and SiC islands on SiO 2 are lifted off by SiO 2 sacrificial etching. Finally, movable SiC microstructures were fabricated by the developed surface micromachining technology.
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U2 - 10.1109/MEMSYS.2009.4805481
DO - 10.1109/MEMSYS.2009.4805481
M3 - Conference article
AN - SCOPUS:65949088594
SN - 1084-6999
SP - 709
EP - 712
JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
JF - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
M1 - 4805481
T2 - 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
Y2 - 25 January 2009 through 29 January 2009
ER -