Silicon migration seal wafer-level vacuum encapsulation

Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Yoshiaki Kanamori, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.

Original languageEnglish
Pages (from-to)165-169
Number of pages5
JournalIEEJ Transactions on Sensors and Micromachines
Issue number7
Publication statusPublished - 2020


  • Epi-Sea
  • Hydrogen anneal
  • Silicon migration
  • Vacuum sealing
  • Wafer-level packaging

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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