Silicon migration seal wafer-level vacuum encapsulation

Yukio Suzuki; Victor Dupuit; Toshiya Kojima; Yoshiaki Kanamori; Shuji Tanaka

doi:10.1541/IEEJSMAS.140.165

Silicon migration seal wafer-level vacuum encapsulation

Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Yoshiaki Kanamori, Shuji Tanaka

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.

Original language	English
Pages (from-to)	165-169
Number of pages	5
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	140
Issue number	7
DOIs	https://doi.org/10.1541/IEEJSMAS.140.165
Publication status	Published - 2020

Keywords

Epi-Sea
Hydrogen anneal
Silicon migration
Vacuum sealing
Wafer-level packaging

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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10.1541/IEEJSMAS.140.165

Cite this

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title = "Silicon migration seal wafer-level vacuum encapsulation",

abstract = "Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.",

keywords = "Epi-Sea, Hydrogen anneal, Silicon migration, Vacuum sealing, Wafer-level packaging",

author = "Yukio Suzuki and Victor Dupuit and Toshiya Kojima and Yoshiaki Kanamori and Shuji Tanaka",

year = "2020",

doi = "10.1541/IEEJSMAS.140.165",

language = "English",

volume = "140",

pages = "165--169",

journal = "IEEJ Transactions on Sensors and Micromachines",

issn = "1341-8939",

publisher = "The Institute of Electrical Engineers of Japan",

number = "7",

}

TY - JOUR

T1 - Silicon migration seal wafer-level vacuum encapsulation

AU - Suzuki, Yukio

AU - Dupuit, Victor

AU - Kojima, Toshiya

AU - Kanamori, Yoshiaki

AU - Tanaka, Shuji

PY - 2020

Y1 - 2020

N2 - Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.

AB - Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.

KW - Epi-Sea

KW - Hydrogen anneal

KW - Silicon migration

KW - Vacuum sealing

KW - Wafer-level packaging

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DO - 10.1541/IEEJSMAS.140.165

M3 - Article

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SN - 1341-8939

VL - 140

SP - 165

EP - 169

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

IS - 7

ER -

Silicon migration seal wafer-level vacuum encapsulation

Abstract

Keywords

ASJC Scopus subject areas

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