Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

Original languageEnglish
Title of host publication2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
PublisherIEEE Computer Society
ISBN (Electronic)9781509010356
DOIs
Publication statusPublished - 2016 Sept 13
Event21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
Duration: 2016 Jul 312016 Aug 4

Publication series

NameInternational Conference on Optical MEMS and Nanophotonics
Volume2016-September
ISSN (Print)2160-5033
ISSN (Electronic)2160-5041

Conference

Conference21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
Country/TerritorySingapore
CitySingapore
Period16/7/3116/8/4

Keywords

  • deformation
  • Low-temperature bonding
  • micromirrors
  • molding

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