Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Masahiro Yamaguchi; Takeshi Yanai; Hidetoshi Nakayama; Ranajit Sai; Hiroaki Fujiwara; Yuki Kitai; Mikio Sato; Ushio Sangawa

doi:10.1109/TMAG.2018.2866126

Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Masahiro Yamaguchi, Takeshi Yanai, Hidetoshi Nakayama, Ranajit Sai, Hiroaki Fujiwara, Yuki Kitai, Mikio Sato, Ushio Sangawa

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

Original language	English
Article number	8458383
Journal	IEEE Transactions on Magnetics
Volume	54
Issue number	11
DOIs	https://doi.org/10.1109/TMAG.2018.2866126
Publication status	Published - 2018 Nov
Externally published	Yes

Keywords

Electroplated multilayer
I/O interface board
Ni-Fe
skin effect suppression

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/TMAG.2018.2866126

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title = "Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board",

abstract = "Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.",

keywords = "Electroplated multilayer, I/O interface board, Ni-Fe, skin effect suppression",

author = "Masahiro Yamaguchi and Takeshi Yanai and Hidetoshi Nakayama and Ranajit Sai and Hiroaki Fujiwara and Yuki Kitai and Mikio Sato and Ushio Sangawa",

note = "Funding Information: ACKNOWLEDGMENT This work was supported in part by the DST-JSPS joint bilateral research project, “Development of low temperature processing of ferrite thin films for on-chip integrated device applications in beyond-4G (X-band) cellular phone systems,” JSPS KAKENHI Grant Number 17K14674, and in part by Tohoku University through the Cooperative Research Project Program of the RIEC under Grant H27-B05. Publisher Copyright: {\textcopyright} 1965-2012 IEEE.",

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doi = "10.1109/TMAG.2018.2866126",

language = "English",

volume = "54",

journal = "IEEE Transactions on Magnetics",

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AU - Yamaguchi, Masahiro

AU - Yanai, Takeshi

AU - Nakayama, Hidetoshi

AU - Sai, Ranajit

AU - Fujiwara, Hiroaki

AU - Kitai, Yuki

AU - Sato, Mikio

AU - Sangawa, Ushio

N1 - Funding Information: ACKNOWLEDGMENT This work was supported in part by the DST-JSPS joint bilateral research project, “Development of low temperature processing of ferrite thin films for on-chip integrated device applications in beyond-4G (X-band) cellular phone systems,” JSPS KAKENHI Grant Number 17K14674, and in part by Tohoku University through the Cooperative Research Project Program of the RIEC under Grant H27-B05. Publisher Copyright: © 1965-2012 IEEE.

PY - 2018/11

Y1 - 2018/11

N2 - Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

AB - Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression technology for long wiring on high-speed and low-delay I/O board. An 11.9 μ m-thick Ni-Fe/Cu multilayer consisting of 0.25 μ m-thick Ni-Fe and 0.51 μ m-thick Cu in turn was electroplated, patterned into 609 μ m-wide and 40 mm-long signal line of microstrip line (MSL) on a 250 μ m-thick printed circuit board. Targeted frequency was 15 GHz, where relative real part permeability was supposed to be-2. The 40 mm-long Ni-Fe/Cu multilayer exhibited the insertion as small as 0.7 dB up to 25 GHz, which is almost the same as the copper monolayer MSL of the same geometry.

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Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

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