TY - GEN
T1 - Standby-power-free integrated circuits using MTJ-based VLSI computing for IoT applications
AU - Hanyu, Takahiro
N1 - Funding Information:
Acknowledgment: This research was supported by ImPACT of CSTI.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/6/28
Y1 - 2017/6/28
N2 - In -The next-generation Internet of Things (IoT) era, it is strongly required to construct new paradigm computer architectures that consume ultra-low power while maintaining high-performance computing. In -The distributed wireless sensor network devices working in a harvested energy environment, power-management techniques play important roles to provide -The best performance with a limited time-dependent energy source. However, in -The present CMOS-only-based VLSI, communication bottlenecks between -The memory and logic modules inside a VLSI chip, as well as increasing standby power dissipation and PVT variation effects, limit -The solutions to -The above problems. In conventional logic-LSI architecture, logic and memory modules are separately implemented, and -These modules are connected to each o-Ther through global interconnections. Even if -The device feature size is scaled down in accordance with -The semiconductor technology roadmap [1], -The global interconnections are not shortened; ra-Ther, -They are becoming longer, resulting in longer delay and higher power dissipation due to interconnections. In addition, because on-chip memory modules are 'volatile,' -They always consume static power to maintain -The stored data.
AB - In -The next-generation Internet of Things (IoT) era, it is strongly required to construct new paradigm computer architectures that consume ultra-low power while maintaining high-performance computing. In -The distributed wireless sensor network devices working in a harvested energy environment, power-management techniques play important roles to provide -The best performance with a limited time-dependent energy source. However, in -The present CMOS-only-based VLSI, communication bottlenecks between -The memory and logic modules inside a VLSI chip, as well as increasing standby power dissipation and PVT variation effects, limit -The solutions to -The above problems. In conventional logic-LSI architecture, logic and memory modules are separately implemented, and -These modules are connected to each o-Ther through global interconnections. Even if -The device feature size is scaled down in accordance with -The semiconductor technology roadmap [1], -The global interconnections are not shortened; ra-Ther, -They are becoming longer, resulting in longer delay and higher power dissipation due to interconnections. In addition, because on-chip memory modules are 'volatile,' -They always consume static power to maintain -The stored data.
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U2 - 10.1109/E3S.2017.8246172
DO - 10.1109/E3S.2017.8246172
M3 - Conference contribution
AN - SCOPUS:85041486708
T3 - 2017 5th Berkeley Symposium on Energy Efficient Electronic Systems, E3S 2017 - Proceedings
SP - 1
EP - 3
BT - 2017 5th Berkeley Symposium on Energy Efficient Electronic Systems, E3S 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th Berkeley Symposium on Energy Efficient Electronic Systems, E3S 2017
Y2 - 19 October 2017 through 20 October 2017
ER -