TY - GEN
T1 - Sterilization of Escherichia coli by a coaxial microwave plasma flow
AU - Sato, Takehiko
AU - Doi, Akiko
AU - Urayama, Takuya
AU - Nakatani, Tatsuyuki
AU - Miyahara, Takashi
PY - 2005
Y1 - 2005
N2 - An atmospheric low temperature plasma flow generated by microwave discharge utilizing a coaxial cable for microwave transmission has some advantages such as portability, simple configuration, and low power operation. It mainly consists of a cavity, a quartz discharge tube, a coaxial cable, a microwave power source and a gas supply system. Using this argon plasma source, we investigated to clarify effects of exposure temperature, exposure time, exposure distance, input power and gas flow rate on the number of surviving cells of Escherichia coli. A log reduction number of E. coli of at least 3 (10 -3) was obtained at exposure temperatures of 353 K when the exposure time was 600 seconds with a gas flow rate of 5 Sl/min and an input power of 400 W. Number of surviving cells decreases with increase of exposure time in any sterilization conditions.
AB - An atmospheric low temperature plasma flow generated by microwave discharge utilizing a coaxial cable for microwave transmission has some advantages such as portability, simple configuration, and low power operation. It mainly consists of a cavity, a quartz discharge tube, a coaxial cable, a microwave power source and a gas supply system. Using this argon plasma source, we investigated to clarify effects of exposure temperature, exposure time, exposure distance, input power and gas flow rate on the number of surviving cells of Escherichia coli. A log reduction number of E. coli of at least 3 (10 -3) was obtained at exposure temperatures of 353 K when the exposure time was 600 seconds with a gas flow rate of 5 Sl/min and an input power of 400 W. Number of surviving cells decreases with increase of exposure time in any sterilization conditions.
KW - Atmospheric Pressure
KW - Colony Counting
KW - Escherichia coli
KW - Low Temperature
KW - Morphological analysis
KW - Plasma Flow
KW - Sterilization
UR - http://www.scopus.com/inward/record.url?scp=33745906803&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33745906803&partnerID=8YFLogxK
U2 - 10.1109/IAS.2005.1518416
DO - 10.1109/IAS.2005.1518416
M3 - Conference contribution
AN - SCOPUS:33745906803
SN - 0780392086
SN - 0780392086
SN - 9780780392083
T3 - Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)
SP - 767
EP - 770
BT - Conference Record of the 2005 IEEE Industry Applications Conference, 40th IAS Annual Meeting
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2005 IEEE Industry Applications Conference, 40th IAS Annual Meeting
Y2 - 2 October 2005 through 6 October 2005
ER -