TY - GEN
T1 - Stopband characteristics of planar-type electromagnetic bandgap structure with ferrite film
AU - Toyota, Yoshitaka
AU - Kondo, Koichi
AU - Yoshida, Shigeyoshi
AU - Iokibe, Kengo
AU - Koga, Ryuji
PY - 2010
Y1 - 2010
N2 - The noise suppression effect after interposing a ferrite film of several microns in thickness between the power and ground planes is discussed in this paper. In particular, we focused on the combination of a planar electromagnetic bandgap structure with a ferrite film deposited by using spin spray ferrite plating at a low temperature. In this paper, the stopband characteristics are discussed through the use of both simulation and measurement results. First, a full-wave electromagnetic simulation revealed that a test board with a dielectric as thin as a few hundreds of microns has the stopband characteristics of the frequency shift towards the lower frequencies (miniaturization effect) and stopband expansion with the removal of the passband, which was not observed in the case of a thick-dielectric test board. The simulation results also demonstrated that these improvements mainly resulted from the complex permeability of the ferrite film. Next, we found that the measurements are very similar to the simulation results.
AB - The noise suppression effect after interposing a ferrite film of several microns in thickness between the power and ground planes is discussed in this paper. In particular, we focused on the combination of a planar electromagnetic bandgap structure with a ferrite film deposited by using spin spray ferrite plating at a low temperature. In this paper, the stopband characteristics are discussed through the use of both simulation and measurement results. First, a full-wave electromagnetic simulation revealed that a test board with a dielectric as thin as a few hundreds of microns has the stopband characteristics of the frequency shift towards the lower frequencies (miniaturization effect) and stopband expansion with the removal of the passband, which was not observed in the case of a thick-dielectric test board. The simulation results also demonstrated that these improvements mainly resulted from the complex permeability of the ferrite film. Next, we found that the measurements are very similar to the simulation results.
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U2 - 10.1109/APEMC.2010.5475608
DO - 10.1109/APEMC.2010.5475608
M3 - Conference contribution
AN - SCOPUS:77954972937
SN - 9781424456215
T3 - 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
SP - 664
EP - 667
BT - 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
T2 - 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
Y2 - 12 April 2010 through 16 April 2010
ER -