TY - JOUR
T1 - Strengthening mechanisms of graphene coated copper under nanoindentation
AU - Zhao, Yinbo
AU - Peng, Xianghe
AU - Fu, Tao
AU - Zhu, Xiaofei
AU - Hu, Ning
AU - Yan, Cheng
N1 - Funding Information:
This work was supported by National Natural Science Foundation of China (Grant Nos. 11332013 , 11372104 , 11632004 ), ARC Discovery Project ( 150101717 ), Key Program for International Science and Technology Cooperation Projects of Ministry of Science and Technology of China (No. 2016YFE0125900 ), the program of China Scholarships Council (No. 201606050043 ), The High Performance Computing (HPC) and CARF at QUT have kindly provided access to their facilities.
Publisher Copyright:
© 2017
PY - 2018/3
Y1 - 2018/3
N2 - We conduct molecular dynamics simulations to investigate the strengthening mechanisms of monolayer graphene coated copper during nanoindentation. It was found that the fracture of the graphene coating includes three stages: (i) initiation of decagon defects, (ii) growth of decagon defects, and (iii) formation of pearl necklace like structure. After the graphene breaks, the intact graphene coating around the indentation still plays a role in strengthening the copper substrate. The shear modulus mismatch and the lattice mismatch at the interface result in the image and misfit stresses, which act as a barrier to impede dislocations to slip out of the copper surface, thereinto, the image stress is the dominant. In addition, it is interesting to observe pristmatic partial dislocation loop and twinning planes during the indentation.
AB - We conduct molecular dynamics simulations to investigate the strengthening mechanisms of monolayer graphene coated copper during nanoindentation. It was found that the fracture of the graphene coating includes three stages: (i) initiation of decagon defects, (ii) growth of decagon defects, and (iii) formation of pearl necklace like structure. After the graphene breaks, the intact graphene coating around the indentation still plays a role in strengthening the copper substrate. The shear modulus mismatch and the lattice mismatch at the interface result in the image and misfit stresses, which act as a barrier to impede dislocations to slip out of the copper surface, thereinto, the image stress is the dominant. In addition, it is interesting to observe pristmatic partial dislocation loop and twinning planes during the indentation.
KW - Graphene/copper
KW - Molecular dynamics simulation
KW - Nanoindentation
KW - Strengthening mechanism
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U2 - 10.1016/j.commatsci.2017.12.009
DO - 10.1016/j.commatsci.2017.12.009
M3 - Article
AN - SCOPUS:85038036262
SN - 0927-0256
VL - 144
SP - 42
EP - 49
JO - Computational Materials Science
JF - Computational Materials Science
ER -