Stress-development mechanism during cobalt-silicide film formation

Hiromi Shimazu, Hideo Miura

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


The silicidation-induced stress developing during Co-silicide formation was discussed experimentally. Co films deposited on Si substrates were annealed to form the silicide films. The formation of CoSi and CoSi2 started at about 400°C and 600°C, respectively. The stress-development mechanism in the reacted films was discussed based on the measurement results of both the internal stress and the thermal stress of Co, CoSi and CoSi2 films. Silicidation-induced stress was defined as the difference between the measured internal stress after the silicidation and the assumed internal stress which was calculated by extending thermal stress curve before silicidation. The silicidation-induced stresses were about 300 MPa for CoSi formation and about 500 MPa for CoSi2 formation.

Original languageEnglish
Pages (from-to)1392-1397
Number of pages6
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Issue number647
Publication statusPublished - 2000


  • Cobalt
  • Experimental stress analysis
  • Residual stress
  • Silicide
  • Thermal stress
  • Thin film


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