Abstract
A program practical that enables design engineers to simply design thermal resistance of IC packages has been developed. Template solid models of IC packages and an automatic system for determining heat transfer coefficient are included in the program. The program does not require the design engineers to have a special knowledge of thermal analysis, and it runs on a personal computer with a 200-MHz PowerPC 604 using 13 MB of RAM. It takes only about 10 seconds to calculate thermal resistance of a quad flat package (QFP) mounted on a printed circuit board (PCB). The error between the calculated and measured values was confirmed to be within about +/-20% by 144-case investigations. A thermally enhanced QFP with a heat spreader (JEDEC code: MO-204) has been developed using this program.
| Original language | English |
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| Pages (from-to) | 1088-1095 |
| Number of pages | 8 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - 1999 |
| Event | Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA Duration: 1999 Jun 1 → 1999 Jun 4 |