Study of microstructure evolution and properties of Cu-Fe microcomposites produced by a pre-alloyed powder method

Fenglin Wang, Kimio Wakoh, Yunping Li, Shun Ito, Kenta Yamanaka, Yuichiro Koizumi, Akihiko Chiba

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)


In this work, Cu-based microcomposites were fabricated by powder metallurgy of gas-atomized Cu-15wt% Fe alloy powder, followed by drawing to various strains. The microstructure evolution and the resultant mechanical and electrical properties were investigated by scanning electron microscopy, electron backscatter diffraction, and tensile testing, among other techniques. The results indicated that during drawing, the Fe phase evolved into nanoscale filaments along the longitudinal direction. With increasing drawing strain, both the Cu grains and the Fe filaments were refined gradually, giving rise to a mean thickness of approximately 25 nm for the Fe filaments at a total strain of 4.0. The iron oxides particles formed due to contamination of oxygen maintained unchanged during drawing process. In addition, it was found that an intermediate aging during the drawing can significantly enhance the electrical conductivity of the microcomposites without sacrificing their strength. The present process involving an initial powder with a homogenous distribution of Cu and fine Fe phases makes it possible to obtain microcomposites with an ideal combination of electrical and mechanical properties at lower drawing strain, compared to those produced by conventional casting methods.

Original languageEnglish
Pages (from-to)64-72
Number of pages9
JournalMaterials and Design
Publication statusPublished - 2017 Jul 15


  • Cu-Fe microcomposite
  • Electrical conductivity
  • Hot consolidation
  • In situ technique
  • Microstructure evolution
  • Strength


Dive into the research topics of 'Study of microstructure evolution and properties of Cu-Fe microcomposites produced by a pre-alloyed powder method'. Together they form a unique fingerprint.

Cite this