Study on mechanical properties for epoxy resin by molecular dynamics

M. Onodera, T. Okabe, M. Hasimoto, K. Yoshioka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We investigated curing characteristics and mechanical properties of Epoxy systems by experimentation and numerical simulation. We proposed a new curing simulation based on MD simulations considering detailed reactivity mechanisms, and we also investigated mechanical properties of epoxy resin using MD simulations. In order to validate the simulation results, we utilized differential scanning calorimetry (DSC) measurements for evaluating the curing process experimentally and conducted the compression and tensile tests to assess mechanical properties.

Original languageEnglish
Title of host publication28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
Pages220-231
Number of pages12
Publication statusPublished - 2013
Event28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013 - State College, PA, United States
Duration: 2013 Sept 92013 Sept 11

Publication series

Name28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
Volume1

Conference

Conference28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
Country/TerritoryUnited States
CityState College, PA
Period13/9/913/9/11

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