Study on the electric performances of planar inductor with Fe-system magnetic flake composite integrated for SiP DC-to-DC converter applications

Y. Endo, H. Sato, T. Miyazaki, M. Yamaguchi, H. Kamada, M. Takahashi, M. Sakamoto, S. Maita, N. Kato, Y. Yorozu, T. Yasui

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Electronic products such as phone handsets and table PC have been highly-miniaturized, and their functionality and performance have increased. In particular, high power density integrated passives accelerate industrial and consumer applications of one-chip DC-to-DC converters, since the converters which are closer to the load were required in order to minimize efficiency losses and reduce the effects of interconnect parasitics[1]. Herein, this paper reports the electric performances of a planar toroidal inductor with Fe-system magnetic flake composites integrated to a test SiP converter. The proposed inductor with the magnetic flake composite offers 1-10 W solution in the frequency range between 1-10 MHz and can be thinner than bulky ferrite inductors while thicker than sputter-deposited thin film inductors because of thick film composite structure of an amorphous Fe-B-Si-C magnetic flakes with high saturation magnetization (1.64 Tesla).

Original languageEnglish
Title of host publication2015 IEEE International Magnetics Conference, INTERMAG 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479973224
DOIs
Publication statusPublished - 2015 Jul 14
Event2015 IEEE International Magnetics Conference, INTERMAG 2015 - Beijing, China
Duration: 2015 May 112015 May 15

Publication series

Name2015 IEEE International Magnetics Conference, INTERMAG 2015

Conference

Conference2015 IEEE International Magnetics Conference, INTERMAG 2015
Country/TerritoryChina
CityBeijing
Period15/5/1115/5/15

Fingerprint

Dive into the research topics of 'Study on the electric performances of planar inductor with Fe-system magnetic flake composite integrated for SiP DC-to-DC converter applications'. Together they form a unique fingerprint.

Cite this