Abstract
We propose and demonstrate a novel technique using focused Si ion beam implantation to produce high-quality mesoscopic channels. Low-energy Si implantation compensates the surface potential of a modulation-doped heterostructure that is designed to have no conductive channels at the heterointerface. The implantation forms a conductive channel separated from the damaged implanted region. The mobility of the channel is improved by decreasing the ion energy from 100 to 35 keV. Sub-μm to 5 μm wide channels fabricated by 35 keV Si+ ions show a mobility of 5.3×105 cm2/V s and a ballistic length of 3.1 μm at 1.5 K.
Original language | English |
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Pages (from-to) | 51-53 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 63 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1993 |