TY - GEN
T1 - Super chip integration technology for three-dimensionally stacked retinal prosthesis chips
AU - Fukushima, Takafumi
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
N1 - Publisher Copyright:
© 2009 beiAKA Verlag Heidelberg.
PY - 2009
Y1 - 2009
N2 - We have developed 3-D integration technology based on a wafer-to-wafer bonding method, fabricated several kinds of 3-D prototype chips, and confirmed their basic operation. To overcome a throughput problem in the conventional die-to-wafer 3-D integration, we newly proposed self-assembled die-to-wafer 3-D integration technology called Super Chip Integration, where a new chip self-assembly technique using liquid surface tension is introduced. A large number of chips can be quickly and precisely self-assembled onto Si substrate with an alignment accuracy of ∼0.4 μm. These chips can be also self-assembled onto polymeric substrates.
AB - We have developed 3-D integration technology based on a wafer-to-wafer bonding method, fabricated several kinds of 3-D prototype chips, and confirmed their basic operation. To overcome a throughput problem in the conventional die-to-wafer 3-D integration, we newly proposed self-assembled die-to-wafer 3-D integration technology called Super Chip Integration, where a new chip self-assembly technique using liquid surface tension is introduced. A large number of chips can be quickly and precisely self-assembled onto Si substrate with an alignment accuracy of ∼0.4 μm. These chips can be also self-assembled onto polymeric substrates.
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M3 - Conference contribution
AN - SCOPUS:85064689544
T3 - Smart Systems Integration 2009, SSI 2009
SP - 299
EP - 306
BT - Smart Systems Integration 2009, SSI 2009
PB - AKA Verlag
T2 - Smart Systems Integration Conference 2009, SSI 2009
Y2 - 10 March 2009 through 11 March 2009
ER -