Suppression of ambient-temperature creep in CP-Ti by cold-rolling

Biochemistry, Genetics and Molecular Biology

• Reduction (Chemistry) 100%
• Steady State 75%
• Environmental Temperature 75%
• Density 75%
• Thickness 75%
• Dislocation 50%
• Stress 25%
• Sample 25%

Engineering

• Ambient Temperature 75%
• Thickness Reduction 75%
• Cold Rolling 50%
• Temperature Creep 50%
• Applied Stress 50%
• Dislocation Density 50%
• Creep Rate 50%
• Creep Test 25%
• Rolled Sample 25%
• Reduction 25%
• Density 25%

Physics

• Ambient Temperature 75%
• Steady State Creep 75%
• Cold Rolling 50%
• Increasing 50%
• Creep Tests 25%
• Retarding 25%