Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC

Tamotsu Nishino, Kenichi Maeda, Mitsuhiro Shimozawa, Takayuki Ikushima, Keiichi Sadahiro, Takatoshi Katsura, Noriharu Suematsu, Kenji Itoh, Hideyuki Oohashi, Tadashi Takagi, Osami Ishida

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)


Techniques to obtain high isolation property in a multi-chip module (MCM) between pads of a SiGe-MMIC flip-chipped on a low temperature co-fired ceramic (LTCC) are discussed. In such a MCM, there are two coupling paths. One is a path through the LTCC and the other is a path through the MMIC. To improve the total isolation property, structures to reduce the two coupling paths are required because the paths of such leaks are not in series but in parallel. We examined disposition of several kinds of ground patterns on the LTCC. Also, we devised a metal plate on a bias circuit as a shielding structure on the SiGe-MMIC. The effectiveness of the isolating structures was verified by measuring IIP2 in a receiver MCM with a direct conversion SiGe-MMIC. The IIP2 property has been improved successfully as well as the isolation property.

Original languageEnglish
Pages (from-to)1385-1388
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Publication statusPublished - 2002 Jan 1
Externally publishedYes
EventIEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States
Duration: 2002 Jun 22002 Jun 7

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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