TY - JOUR
T1 - Suppression of spurious vibration of cantilever in atomic force microscopy by enhancement of bending rigidity of cantilever chip substrate
AU - Tsuji, Toshihiro
AU - Kobari, Kentaro
AU - Ide, Seishiro
AU - Yamanaka, Kazushi
PY - 2007/11/19
Y1 - 2007/11/19
N2 - To improve the precision of dynamic atomic force microscopy (AFM) using cantilever vibration spectra, a simple but effective method for suppressing spurious response (SR) was developed. The dominant origin of SR was identified to be the bending vibration of the cantilever substrate, by the analysis of the frequency of SR. Although a rigid cover pressing the whole surface of the substrate suppressed SR, the utility was insufficient. Then, a method of enhancing the bending rigidity of the substrate by gluing a rigid plate (clamping plate, CP) to the substrate was developed. This chip can be used with an ordinary cantilever holder, so that the reproducibility of SR suppression when attaching and detaching the cantilever chip to the holder was improved. To verify its utility, the evaluation of a microdevice electrode was performed by ultrasonic atomic force microscopy. The delamination at a submicron depth was visualized and the detailed variation of the delamination was evaluated for the first time using clear resonance spectra. The CP method will particularly contribute to improving dynamic-mode AFM, in which resonance spectra with a low quality factor are used, such as noncontact mode AFM in liquid or contact resonance mode AFM. The effect of the CP can be achieved by fabricating a substrate with a thick plate beforehand.
AB - To improve the precision of dynamic atomic force microscopy (AFM) using cantilever vibration spectra, a simple but effective method for suppressing spurious response (SR) was developed. The dominant origin of SR was identified to be the bending vibration of the cantilever substrate, by the analysis of the frequency of SR. Although a rigid cover pressing the whole surface of the substrate suppressed SR, the utility was insufficient. Then, a method of enhancing the bending rigidity of the substrate by gluing a rigid plate (clamping plate, CP) to the substrate was developed. This chip can be used with an ordinary cantilever holder, so that the reproducibility of SR suppression when attaching and detaching the cantilever chip to the holder was improved. To verify its utility, the evaluation of a microdevice electrode was performed by ultrasonic atomic force microscopy. The delamination at a submicron depth was visualized and the detailed variation of the delamination was evaluated for the first time using clear resonance spectra. The CP method will particularly contribute to improving dynamic-mode AFM, in which resonance spectra with a low quality factor are used, such as noncontact mode AFM in liquid or contact resonance mode AFM. The effect of the CP can be achieved by fabricating a substrate with a thick plate beforehand.
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U2 - 10.1063/1.2793498
DO - 10.1063/1.2793498
M3 - Article
C2 - 17979424
AN - SCOPUS:36048971434
SN - 0034-6748
VL - 78
JO - Review of Scientific Instruments
JF - Review of Scientific Instruments
IS - 10
M1 - 103703
ER -