Surface activation process of lead-free solder bumps for low temperature bonding

Ying Hui Wang, Kenji Nishida, Matthias Hutter, Matiar R. Howlader, Eiji Higurashi, Takashi Kimura, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Citations (Scopus)

Abstract

Focused on the problems of the lead-free alloys bonding at high melting temperature, high density, low cost and low temperature lead-free flip chip bonding process was developed by the surface activated bonding (SAB) method. Sn-3.0Ag-0.5Cu (wt %) alloy, with better reliability and solderability than other alternatives for electronic packaging, were chose for the experiments to be bonded with typical electrodes, SnAg, Cu and Au film. The feasibility of Sn3.0Ag-0.5Cu SAB bonding at room temperature was confirmed. The bonding strength in vacuum and N2 was high. In air, it was found that the bonding strength was highly depended on exposure time. Combined with low temperature (150°C), SAB bonding process was developed in air by using 30μm pitch Au/Sn flip chip samples for the first time. Resistance and tensile test showed good electrical and mechanical properties of the bonded Au/Sn samples. Bonding interfaces were observed by scanning electron microscope (SEM) and electron probe micro-analyzer (EPMA).

Original languageEnglish
Title of host publication2005 6th International Conference on Electronics Packaging Technology
PublisherIEEE Computer Society
Pages404-407
Number of pages4
ISBN (Print)0780394496, 9780780394490
DOIs
Publication statusPublished - 2005
Event2005 6th International Conference on Electronics Packaging Technology - Dameisha, Shenzhen, China
Duration: 2005 Aug 302005 Sept 2

Publication series

Name2005 6th International Conference on Electronics Packaging Technology
Volume2005

Conference

Conference2005 6th International Conference on Electronics Packaging Technology
Country/TerritoryChina
CityDameisha, Shenzhen
Period05/8/3005/9/2

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