TY - GEN
T1 - Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration
AU - Thu, Le Hac Huong
AU - Matsumae, Takashi
AU - Kurashima, Yuichi
AU - Takagi, Hideki
AU - Higurashi, Eiji
N1 - Funding Information:
The authors acknowledge Kanto Chemical Co. Inc. for their support in electroless Au plating. This work was supported by JST A-STEP Grant Number JPMJTM20BN, Japan.
Publisher Copyright:
© 2021 IEEE
PY - 2021/10/5
Y1 - 2021/10/5
N2 - This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.
AB - This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.
UR - http://www.scopus.com/inward/record.url?scp=85120411406&partnerID=8YFLogxK
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U2 - 10.1109/LTB-3D53950.2021.9598356
DO - 10.1109/LTB-3D53950.2021.9598356
M3 - Conference contribution
AN - SCOPUS:85120411406
T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
SP - 6
BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Y2 - 5 October 2021 through 11 October 2021
ER -