Abstract
The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03,0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200 K. The linear dependencies of surface tension and density on temperature were observed and they were described by straight-line equations. Moreover, experimental determination of phase diagram and thermodynamic calculations in the Sn-Ag-Sb system were performed and the resulting optimized thermodynamic parameters were used for modeling of the surface tension. In addition, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior of a Sn-Ag-Sb alloy.
Original language | English |
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Pages (from-to) | 652-660 |
Number of pages | 9 |
Journal | Materials Transactions |
Volume | 45 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2004 Mar |
Keywords
- Calphad
- Lead-free solder
- Microsoldering
- Thermodynamics