@inproceedings{b5907cedf2f548bc9d579a6aa70e62d7,
title = "Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration",
abstract = "Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.",
author = "Y. Ito and T. Fukushima and Lee, {K. W.} and K. Choki and T. Tanaka and M. Koyanagi",
year = "2014",
doi = "10.1109/LTB-3D.2014.6886154",
language = "English",
isbn = "9781479952618",
series = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",
publisher = "IEEE Computer Society",
pages = "15",
booktitle = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",
address = "United States",
note = "2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 ; Conference date: 15-07-2014 Through 16-07-2014",
}