TY - GEN
T1 - Tactile Sensing From Backside of Flexible Printed Circuit Using LSI-Integrated Sensor with Elastic Dome Structure
AU - Teranishi, Tatsuki
AU - Hirano, Hideki
AU - Tanaka, Shuji
N1 - Funding Information:
This work is supported by the New Energy and Industrial Technology Development Organization (NEDO) Japan and partly supported by “Nanotechnology Platform” of MEXT, Japan. The authors thank to Dow Toray Co., Ltd. Japan for their offering PDMS materials.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - This paper presents a new configuration of CMOS-LSI integrated tactile sensor flip-chip-bonded on a flexible printed circuit (FPC) in a standard face-down manner. The tactile sensors receive force from the backside of the FPC through an elastic dome structure. Device layer transfer process using fly-cut planarized metal bonding technology was developed for the LSI-MEMS integration. The fabrication of this configuration is much easier than that of the previous one, where an LSI-integrated sensor is connected to the FPC in a face-up manner via through-silicon vias (TSVs) in the LSI. In addition, the sensitivity of the integrated sensor can be adjusted by optimizing elastic modulus of a dome structure, which is made by molding. Finally, the operation of the total system was successfully confirmed.
AB - This paper presents a new configuration of CMOS-LSI integrated tactile sensor flip-chip-bonded on a flexible printed circuit (FPC) in a standard face-down manner. The tactile sensors receive force from the backside of the FPC through an elastic dome structure. Device layer transfer process using fly-cut planarized metal bonding technology was developed for the LSI-MEMS integration. The fabrication of this configuration is much easier than that of the previous one, where an LSI-integrated sensor is connected to the FPC in a face-up manner via through-silicon vias (TSVs) in the LSI. In addition, the sensitivity of the integrated sensor can be adjusted by optimizing elastic modulus of a dome structure, which is made by molding. Finally, the operation of the total system was successfully confirmed.
KW - CMOS-MEMS integration
KW - Elastic dome structure
KW - Flexible printed circuit
KW - Metal bonding
KW - PDMS
KW - Serial bus network
KW - Tactile sensor
UR - http://www.scopus.com/inward/record.url?scp=85071953327&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071953327&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2019.8808705
DO - 10.1109/TRANSDUCERS.2019.8808705
M3 - Conference contribution
AN - SCOPUS:85071953327
T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
SP - 547
EP - 550
BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Y2 - 23 June 2019 through 27 June 2019
ER -