@inproceedings{97b3f71ba3de4e74a9ad79ce654adf70,
title = "Technological platform for vertical multi-wafer integration of miniature imaging instruments",
abstract = "We describe a technological platform developed for miniaturization of optical imaging instruments, such as laser scanning confocal microscopes or Optical Coherence Tomography devices. The platform employs multi-wafer vertical integration approach, combined with integrated glass-based micro-optics and heterogeneous bonding and interconnecting technologies. In this paper we focus on the unconventional fabrication methods of monolithic micro-optical structures and components in borosilicate glass (e.g. micro beamsplitters, refractive microlenses) for optical beam shaping and routing. In addition, we present hybrid laser-assisted integration of glass ball microlenses on the silicon MEMS actuators for transmissive beam scanning as well as methods of electrical signals distribution through thick glass substrates, based on HF etched via holes.",
keywords = "3-D scanning, Confocal microscopy, Imaging systems, MOEMS, Micro-optics, Microlens Scanner, Microlens integration, Multi-wafer Bonding, Optical Coherence Tomography, Vertical integration",
author = "S. Bargiel and M. Baranski and N. Passilly and C. Gorecki and M. Wiemer and J. Fr{\"o}mel and D. W{\"u}nsch and Wang, {W. S.}",
note = "Publisher Copyright: {\textcopyright} 2015 SPIE.; MOEMS and Miniaturized Systems XIV ; Conference date: 09-02-2015 Through 12-02-2015",
year = "2015",
doi = "10.1117/12.2078007",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Yong-Hwa Park and Wibool Piyawattanametha",
booktitle = "MOEMS and Miniaturized Systems XIV",
address = "United States",
}