Technological platform for vertical multi-wafer integration of microscanners and micro-optical components

Sylwester Bargiel; Maciej Baranski; Maik Wiemer; Jörg Frömel; Wei Shan Wang; Christophe Gorecki

doi:10.3390/mi10030185

Technological platform for vertical multi-wafer integration of microscanners and micro-optical components

Sylwester Bargiel, Maciej Baranski, Maik Wiemer, Jörg Frömel, Wei Shan Wang, Christophe Gorecki

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

Original language	English
Article number	185
Journal	Micromachines
Volume	10
Issue number	3
DOIs	https://doi.org/10.3390/mi10030185
Publication status	Published - 2019

Keywords

Confocal microscopy
MOEMS
Micro-optics
Multi-wafer bonding
Vertical integration

Access to Document

10.3390/mi10030185

Cite this

@article{a1a5f88490094cd6b0052a3fe71d71bf,

title = "Technological platform for vertical multi-wafer integration of microscanners and micro-optical components",

abstract = "We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.",

keywords = "Confocal microscopy, MOEMS, Micro-optics, Multi-wafer bonding, Vertical integration",

author = "Sylwester Bargiel and Maciej Baranski and Maik Wiemer and J{\"o}rg Fr{\"o}mel and Wang, {Wei Shan} and Christophe Gorecki",

note = "Publisher Copyright: {\textcopyright} 2019 by the authors.",

year = "2019",

doi = "10.3390/mi10030185",

language = "English",

volume = "10",

journal = "Micromachines",

issn = "2072-666X",

publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",

number = "3",

}

TY - JOUR

T1 - Technological platform for vertical multi-wafer integration of microscanners and micro-optical components

AU - Bargiel, Sylwester

AU - Baranski, Maciej

AU - Wiemer, Maik

AU - Frömel, Jörg

AU - Wang, Wei Shan

AU - Gorecki, Christophe

PY - 2019

Y1 - 2019

N2 - We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

AB - We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

KW - Confocal microscopy

KW - MOEMS

KW - Micro-optics

KW - Multi-wafer bonding

KW - Vertical integration

UR - http://www.scopus.com/inward/record.url?scp=85063563844&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85063563844&partnerID=8YFLogxK

U2 - 10.3390/mi10030185

DO - 10.3390/mi10030185

M3 - Article

AN - SCOPUS:85063563844

SN - 2072-666X

VL - 10

JO - Micromachines

JF - Micromachines

IS - 3

M1 - 185

ER -

Technological platform for vertical multi-wafer integration of microscanners and micro-optical components

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this