Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID

Mario Baum, Jörg Frömel, Christian Hofmann, Maik Wiemer, Karla Hiller, Harald Kuhn

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.

Original languageEnglish
Title of host publication2021 IEEE CPMT Symposium Japan, ICSJ 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages31-32
Number of pages2
ISBN (Electronic)9781665440790
DOIs
Publication statusPublished - 2021
Event10th IEEE CPMT Symposium Japan, ICSJ 2021 - Kyoto, Japan
Duration: 2021 Nov 102021 Nov 12

Publication series

Name2021 IEEE CPMT Symposium Japan, ICSJ 2021

Conference

Conference10th IEEE CPMT Symposium Japan, ICSJ 2021
Country/TerritoryJapan
CityKyoto
Period21/11/1021/11/12

Keywords

  • Deposition
  • Inductive heating
  • Joining
  • Low temperature
  • SLID
  • Solid liquid interdiffusion
  • Wafer bonding

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