Temporary bonding strength control for self-assembly-based 3D integration

Takafumi Fukushima; Yuki Ohara; Jicheol Bea; Mariappan Murugesan; Kang Wook Lee; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/3DIC.2012.6262954

Temporary bonding strength control for self-assembly-based 3D integration

Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6262954
Publication status	Published - 2011
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: 2012 Jan 31 → 2012 Feb 2

Publication series

Name	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Conference

Conference	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country/Territory	Japan
City	Osaka
Period	12/1/31 → 12/2/2

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10.1109/3DIC.2012.6262954

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Fukushima, T., Ohara, Y., Bea, J., Murugesan, M., Lee, K. W., Tanaka, T., & Koyanagi, M. (2011). Temporary bonding strength control for self-assembly-based 3D integration. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 Article 6262954 (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6262954

@inproceedings{66f1d2b147a14eae8ed64c939145a751,

title = "Temporary bonding strength control for self-assembly-based 3D integration",

abstract = "We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.",

author = "Takafumi Fukushima and Yuki Ohara and Jicheol Bea and Mariappan Murugesan and Lee, {Kang Wook} and Tetsu Tanaka and Mitsumasa Koyanagi",

year = "2011",

doi = "10.1109/3DIC.2012.6262954",

language = "English",

isbn = "9781467321891",

series = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

booktitle = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

note = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 ; Conference date: 31-01-2012 Through 02-02-2012",

}

Fukushima, T, Ohara, Y, Bea, J, Murugesan, M, Lee, KW, Tanaka, T & Koyanagi, M 2011, Temporary bonding strength control for self-assembly-based 3D integration. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6262954, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 12/1/31. https://doi.org/10.1109/3DIC.2012.6262954

Temporary bonding strength control for self-assembly-based 3D integration. / Fukushima, Takafumi; Ohara, Yuki; Bea, Jicheol et al.
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6262954 (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Temporary bonding strength control for self-assembly-based 3D integration

AU - Fukushima, Takafumi

AU - Ohara, Yuki

AU - Bea, Jicheol

AU - Murugesan, Mariappan

AU - Lee, Kang Wook

AU - Tanaka, Tetsu

AU - Koyanagi, Mitsumasa

PY - 2011

Y1 - 2011

N2 - We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.

AB - We have demonstrated bonding strength control for self-assembly-based 3D integration in which many chips are instantly assembled on a wafer all at once by using liquid droplets, and then, temporarily bonded to the wafer. The wafer is named Reconfigured Wafer. The self-assembly-based multichip-to-wafer 3D stacking is called reconfigured-wafer-to-wafer 3D integration. The alignment accuracy is found to be within 1 μm and the temporal bonding strength is well controlled by the quality of oxides as a bonding interface material, liquid types (concentration of additives), total bonding area, and surface roughness of the oxides. The self-assembled and temporarily bonded chips are successfully transferred to another wafer in a face-to-face bonding manner in batch processing.

UR - http://www.scopus.com/inward/record.url?scp=84866863000&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866863000&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2012.6262954

DO - 10.1109/3DIC.2012.6262954

M3 - Conference contribution

AN - SCOPUS:84866863000

SN - 9781467321891

T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Y2 - 31 January 2012 through 2 February 2012

ER -

Temporary bonding strength control for self-assembly-based 3D integration

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