The latest package and assembly technology for SiC power module'

Yoshikazu Takahashi; Hiroyuki Nogawa; Akira Morozumi; Yoshitaka Nishimura

doi:10.1109/ICSJ.2016.7801243

The latest package and assembly technology for SiC power module'

Yoshikazu Takahashi, Hiroyuki Nogawa, Akira Morozumi, Yoshitaka Nishimura

Center for Innovative Integrated Electronic Systems (CIES)

Fuji Electric Co., Ltd.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Citations (Scopus)

Abstract

It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.

Original language	English
Title of host publication	2016 IEEE CPMT Symposium Japan, ICSJ 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-4
Number of pages	4
ISBN (Electronic)	9781509020379
DOIs	https://doi.org/10.1109/ICSJ.2016.7801243
Publication status	Published - 2016 Dec 28
Event	2016 IEEE CPMT Symposium Japan, ICSJ 2016 - Kyoto, Japan Duration: 2016 Nov 7 → 2016 Nov 9

Publication series

Name	2016 IEEE CPMT Symposium Japan, ICSJ 2016

Conference

Conference	2016 IEEE CPMT Symposium Japan, ICSJ 2016
Country/Territory	Japan
City	Kyoto
Period	16/11/7 → 16/11/9

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10.1109/ICSJ.2016.7801243

Cite this

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title = "The latest package and assembly technology for SiC power module'",

abstract = "It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.",

author = "Yoshikazu Takahashi and Hiroyuki Nogawa and Akira Morozumi and Yoshitaka Nishimura",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 IEEE CPMT Symposium Japan, ICSJ 2016 ; Conference date: 07-11-2016 Through 09-11-2016",

year = "2016",

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doi = "10.1109/ICSJ.2016.7801243",

language = "English",

series = "2016 IEEE CPMT Symposium Japan, ICSJ 2016",

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}

Takahashi, Y, Nogawa, H, Morozumi, A & Nishimura, Y 2016, The latest package and assembly technology for SiC power module'. in 2016 IEEE CPMT Symposium Japan, ICSJ 2016., 7801243, 2016 IEEE CPMT Symposium Japan, ICSJ 2016, Institute of Electrical and Electronics Engineers Inc., pp. 1-4, 2016 IEEE CPMT Symposium Japan, ICSJ 2016, Kyoto, Japan, 16/11/7. https://doi.org/10.1109/ICSJ.2016.7801243

The latest package and assembly technology for SiC power module'. / Takahashi, Yoshikazu; Nogawa, Hiroyuki; Morozumi, Akira et al.
2016 IEEE CPMT Symposium Japan, ICSJ 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1-4 7801243 (2016 IEEE CPMT Symposium Japan, ICSJ 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - The latest package and assembly technology for SiC power module'

AU - Takahashi, Yoshikazu

AU - Nogawa, Hiroyuki

AU - Morozumi, Akira

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PY - 2016/12/28

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N2 - It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.

AB - It is expected to be effective for global environmental conservation and energy saving that power electronics technology introduce to a variety of areas of electric power conversion system, such as electric and hybrid electric vehicle (EV/HEV), IT/CPU power supply, general inverter, electric power grid, and electric train. To meet these trends, the performance of Si power devices have been improving up to their performance limitation derived from material properties of Si. On the other hand, silicon carbide (SiC) power devices have been widely researched and developed because of their superior material properties as power device. This paper presents packaging and assembly technologies for new SiC devices which can improve the performances of power electronics systems.

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BT - 2016 IEEE CPMT Symposium Japan, ICSJ 2016

PB - Institute of Electrical and Electronics Engineers Inc.

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Y2 - 7 November 2016 through 9 November 2016

ER -

The latest package and assembly technology for SiC power module'

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