@inproceedings{6bacc590995144b391a341a5bd6a4c24,
title = "The thickness-ratio effects of Ni/Nb electrode on wire bonding strength with n-type 4H-SiC",
abstract = "The thickness-ratio effects of Ni/Nb bi-layer electrodes were studied for power device applications. The reaction microstructure and electrical contact property were investigated after annealing at 1000 °C and compared with the results of an Ni electrode. Microstructure-related problems of the Ni electrode could be successfully resolved without sacrificing ohmic contact behavior by the addition of Nb to a Ni based electrode. Carbon precipitation on the electrode surface was reduced with increasing Nb thickness by the formation of carbides, which led to good adhesion between the electrode and a wiring pad. High shear strength of the bonded wire was also obtained by the elimination of the carbon precipitates on the electrode surface.",
keywords = "Niobium, Ohmic contact, Silicon carbide, Wire bonding",
author = "Kunhwa Jung and Daisuke Ando and Yuji Sutou and Tetsuya Oyamada and Masamoto Tanaka and Junichi Koike",
year = "2012",
doi = "10.4028/www.scientific.net/MSF.717-720.829",
language = "English",
isbn = "9783037854198",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "829--832",
editor = "Devaty, {Robert P.} and Michael Dudley and Chow, {T. Paul} and Neudeck, {Philip G.}",
booktitle = "Silicon Carbide and Related Materials 2011, ICSCRM 2011",
note = "14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011 ; Conference date: 11-09-2011 Through 16-09-2011",
}