Thermal, mechanical and physical properties of supercooled liquid in Pd-Cu-Ni-P amorphous alloy

Hisamichi Kimura, Akihisa Inoue, Nobuyuki Nishiyama, Kenichi Sasamori, Osami Haruyama, Tsuyoshi Masumoto

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


The thermal stability, storage modulus (E'), loss tangent (tanδ), temperature coefficient of thermal expansion (α) and electrical resistivity of a supercooled liquid were measured for an amorphous Pd 40Cu 30Ni 10P 20 alloy with a wide supercooled liquid region before crystallization. The wide supercooled liquid region of 80 K is retained even at the low heating rate of 0.083 K/s. The E' of the supercooled liquid decreases monotonously from 6.0 to 0.35 GPa with increasing temperature from 540 to 590 K and the tanδ increases from 0.07 to 0.52. These changes takes place through a single stage. The α value of the supercooled liquid is measured to be 2.0×10 -2 K -1 which is larger by three orders than that (2.0×10 -5 K -1) for the corresponding amorphous solid. The electrical resistivity decreases through two stages in the range from 2.27 to 2.15 μΩm the supercooled liquid from 563 to 648 K. These physical and mechanical properties of the supercooled liquid are significantly different from those for the corresponding amorphous solid and important for future development of basic science of supercooled liquid and bulk amorphous alloys.

Original languageEnglish
Pages (from-to)101-106
Number of pages6
JournalScience Reports of the Rerearch Institutes Tohoku University Series A-Physics
Issue number2
Publication statusPublished - 1997 Mar 1


  • Coefficient of thermal expansion
  • Electrical resistivity
  • Glass transition
  • Palladium-copper-phosphorus base amorphous alloy
  • Storage modulus
  • Supercooled liquid
  • Thermal dilatation

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Metals and Alloys


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