Abstract
Recent progress on the thermodynamic databases of calculated phase diagrams in microsolders and Cu-based alloys is presented. A thermodynamic tool, Alloy Database for Microsolders (ADAMIS), is based on comprehensive experimental and thermodynamic data accumulated with the calculation of phase diagrams (CALPHAD) method and contains eight elements, namely, Ag, Bi, Cu, In, Sb, Sn, Zn, and Pb. It can handle all combinations of these elements and all composition ranges. The elements of Al and Au have also been added to ADAMIS within a limited range of compositions. Furthermore, a database of Cu-based alloys, including binary (Cu-X), ternary (Cu-Fe-X, Cu-Ni-X, and Cu-Cr-X), and multicomponent (Cu-Ni-Cr-Sn-Zn-Fe-Si) systems, has also been developed. Typical examples of the calculation and application of these databases are presented. These databases are expected to be a powerful tool for the development of Pb-free solders and Cu substrate materials as well as for promoting the understanding of the interfacial phenomena between them in electronic packaging technology.
| Original language | English |
|---|---|
| Pages (from-to) | 1265-1272 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 32 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 2003 Nov |
Keywords
- Calculation of phase diagram
- Cu-based alloys
- Interfacial reaction
- Pb-free solders
- Phase-field method
- Thermodynamic database
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry