Thickness Monitoring of nm Period EUV Multilayer Fabrication by Ellipsometry

Toshihide Tsuru, Takashi Tsutou, Tadashi Hatano, Masaki Yamamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We have adopted our new ellipsometer of picometer-thickness sensitivity for sputtering rate monitoring of extreme ultraviolet (EUV) multilayer fabrication. With real time thickness analysis during Mo/Si multilayer fabrication, the sputtering rates of Mo and Si were observed to be 0.9162nm/min and 4.752nm/min, respectively. EUV reflectance of this multilayer mirror was measured at the Photon Factory KEK and the period thickness was found to be 7.22nm. This period thickness is compared with an ellipsometric value of 6.98nm calculated by the final total thickness divided by the number of periods of 40. The difference of 3.3% can be attributed by a compound layer formation at every boundary of Mo and Si as observe by ellipsometry. The results proved good possibility of a single wavelength in-situ null ellipsometry for accurate and detailed controlling of the period thickness of EUV multilayer.

Original languageEnglish
Title of host publicationSynchrotron Radiation Instrumentation
Subtitle of host publication8th International Conference on Synchrotron Radiation Instrumentation
PublisherAmerican Institute of Physics Inc.
Pages732-735
Number of pages4
ISBN (Electronic)0735401799
DOIs
Publication statusPublished - 2004 May 12
Event8th International Conference on Synchrotron Radiation Instrumentation - San Francisco, United States
Duration: 2003 Aug 252003 Aug 29

Publication series

NameAIP Conference Proceedings
Volume705
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other8th International Conference on Synchrotron Radiation Instrumentation
Country/TerritoryUnited States
CitySan Francisco
Period03/8/2503/8/29

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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