Thin-beam bulk micromachining based on RIE and xenon difluoride silicon etching

Risaku Toda, Kazuyuki Minami, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)


A new process for fabricating thin mechanical beam structures from single-crystal silicon has been developed. Lateral and vertical dimensions of the beam can be precisely defined. The beam is positioned in the middle of a silicon wafer at exactly equal distances from both sides. The beam design is not limited by crystal orientations of silicon. The silicon beam structure is essentially stress free because the whole structure is made of uniformly doped single-crystal silicon. This thin-beam process offers significantly expanded design freedom to bulk silicon micromachining. Additionally, a silicon dioxide structure with very high aspect ratio has been fabricated with a similar technique.

Original languageEnglish
Pages (from-to)268-272
Number of pages5
JournalSensors and Actuators, A: Physical
Issue number1-3
Publication statusPublished - 1998 Apr 1
Externally publishedYes


  • Bulk micromachining
  • Dry etch
  • High aspect ratio
  • Reactive ion etching
  • Three-dimensional structures
  • Xenon difluoride

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering


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