Abstract
It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.
| Original language | English |
|---|---|
| Pages (from-to) | 203-212 |
| Number of pages | 10 |
| Journal | Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon |
| Publication status | Published - 1997 Dec 1 |
| Event | Proceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon - Austin, TX, USA Duration: 1997 Oct 8 → 1997 Oct 10 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Condensed Matter Physics