TY - JOUR
T1 - Three-dimensional micro-coil oscillator fabricated with monolithic process on LSI
AU - Yabe, Tomotaka
AU - Mimura, Yasuhiro
AU - Takahashi, Hirokazu
AU - Onoe, Atsushi
AU - Muroga, Sho
AU - Yamaguchi, Masahiro
AU - Ono, Takahito
AU - Esashi, Masayoshi
PY - 2011
Y1 - 2011
N2 - Integration technique of three-dimensional micro coils on high-performance RF-LSI is one of the key technologies to realize future wireless telecommunication services and hypersensitive capacitance sensor systems. We design and fabricate monolithic three-dimensional micro coils on LSI substrate. The micro-coil has long legs, which will minimize electromagnetic coupling to the LSI substrate. We succeed in confirming the basic operation of the integrated oscillator circuit in GHz frequency range. It is conformed that process damages by plasma ashing, heating at 200 degrees Celsius, and sputter etching process are not observed in the oscillation performance.
AB - Integration technique of three-dimensional micro coils on high-performance RF-LSI is one of the key technologies to realize future wireless telecommunication services and hypersensitive capacitance sensor systems. We design and fabricate monolithic three-dimensional micro coils on LSI substrate. The micro-coil has long legs, which will minimize electromagnetic coupling to the LSI substrate. We succeed in confirming the basic operation of the integrated oscillator circuit in GHz frequency range. It is conformed that process damages by plasma ashing, heating at 200 degrees Celsius, and sputter etching process are not observed in the oscillation performance.
KW - MEMS micro coil
KW - Monolithic technique
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U2 - 10.1541/ieejsmas.131.363
DO - 10.1541/ieejsmas.131.363
M3 - Article
AN - SCOPUS:80055003458
SN - 1341-8939
VL - 131
SP - 363
EP - 368
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
IS - 10
ER -