Three-dimensional micro-coil oscillator fabricated with monolithic process on LSI

Tomotaka Yabe, Yasuhiro Mimura, Hirokazu Takahashi, Atsushi Onoe, Sho Muroga, Masahiro Yamaguchi, Takahito Ono, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review


Integration technique of three-dimensional micro coils on high-performance RF-LSI is one of the key technologies to realize future wireless telecommunication services and hypersensitive capacitance sensor systems. We design and fabricate monolithic three-dimensional micro coils on LSI substrate. The micro-coil has long legs, which will minimize electromagnetic coupling to the LSI substrate. We succeed in confirming the basic operation of the integrated oscillator circuit in GHz frequency range. It is conformed that process damages by plasma ashing, heating at 200 degrees Celsius, and sputter etching process are not observed in the oscillation performance.

Original languageEnglish
Pages (from-to)363-368
Number of pages6
JournalIEEJ Transactions on Sensors and Micromachines
Issue number10
Publication statusPublished - 2011


  • MEMS micro coil
  • Monolithic technique


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