A new method for realizing three-dimensional structures based on the standard silicon-on-insulator microelectromechanical systems is developed using vertically buckled bridges as structural elements. The vertical displacement, profile of the bridge, and obtainable accuracy of the displacement are examined. Using the lateral dimension control of the bridge and the supporting beams, the vertical positioning is realized based on the planer photolithography. As a demonstration, a vertical comb drive actuator is prepared and its performance is examined.
|Number of pages||7|
|Journal||IEEE Journal of Selected Topics in Quantum Electronics|
|Publication status||Published - 2004 May|
- Silicon-on-insulator microelectromechanical systems (SOI-MEMS)
- Three-dimensional (3-D) structure
- Vertical comb drive actuator