TY - GEN
T1 - Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration
AU - Fukushima, Takafumi
AU - Ito, Yuka
AU - Murugesan, Mariappan
AU - Bea, Jicheol
AU - Lee, Kangwook
AU - Choki, Koji
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014
Y1 - 2014
N2 - A 12-channel vertical cavity surface emitting laser (VCSEL) chip was heterogeneously self-assembled to a glass interposer wafer by liquid surface tension as a driving force. The size of the VCSEL chip was 0.35 mm wide and 3 mm long. From the square dummy chips having structurally similar periphery to the VCSEL, the step structure at the chip edge was found to be significantly dependent on the alignment accuracies. From the rectangular dummy chips having the same sizes to the long VCSEL, the tiny chips were precisely self-assembled with alignment accuracies within 2 μm even when they were manually placed on water droplets provided on host Si wafers. After selfassembly of the VCSEL chip and the subsequent thermal compression, the VCSEL was accurately positioned, successfully emitted 850-nm light, and exhibited no degradation of the I-V characteristics. This paper also presents our recent progress on the hybrid integration of chip-scale photonic devices with 3D/TSV technologies for optical interconnections.
AB - A 12-channel vertical cavity surface emitting laser (VCSEL) chip was heterogeneously self-assembled to a glass interposer wafer by liquid surface tension as a driving force. The size of the VCSEL chip was 0.35 mm wide and 3 mm long. From the square dummy chips having structurally similar periphery to the VCSEL, the step structure at the chip edge was found to be significantly dependent on the alignment accuracies. From the rectangular dummy chips having the same sizes to the long VCSEL, the tiny chips were precisely self-assembled with alignment accuracies within 2 μm even when they were manually placed on water droplets provided on host Si wafers. After selfassembly of the VCSEL chip and the subsequent thermal compression, the VCSEL was accurately positioned, successfully emitted 850-nm light, and exhibited no degradation of the I-V characteristics. This paper also presents our recent progress on the hybrid integration of chip-scale photonic devices with 3D/TSV technologies for optical interconnections.
KW - 3D integration
KW - And microubmp bonding
KW - Heterogeneous integration
KW - Hybrid integration
KW - Self-assembly
KW - VCSEL
UR - http://www.scopus.com/inward/record.url?scp=84963837823&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963837823&partnerID=8YFLogxK
U2 - 10.1109/3DIC.2014.7152145
DO - 10.1109/3DIC.2014.7152145
M3 - Conference contribution
AN - SCOPUS:84963837823
T3 - 2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings
BT - 2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International 3D Systems Integration Conference, 3DIC 2014
Y2 - 1 December 2014 through 3 December 2014
ER -