Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

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Biochemistry, Genetics and Molecular Biology

Chemistry

Material Science