TY - GEN
T1 - Tunable monocrystalline silicon grating on LSI circuit fabricated by two-step polymer bonding
AU - Sasaki, T.
AU - Suzuki, T.
AU - Matsuura, H.
AU - Hane, K.
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/9/13
Y1 - 2016/9/13
N2 - This paper shows a fabrication process and device characteristics of the tunable monocrystalline silicon grating on LSI circuit. The thin monocrystalline silicon with thickness of 260 nm was transferred on the LSI circuit, by using the two-step polymer bonding process consisting of polymer patterning and bonding, and liquid-polymer filling. Furthermore, the grating was fabricated on the LSI circuit and the actuation of the grating by serial communication with the LSI circuit was demonstrated.
AB - This paper shows a fabrication process and device characteristics of the tunable monocrystalline silicon grating on LSI circuit. The thin monocrystalline silicon with thickness of 260 nm was transferred on the LSI circuit, by using the two-step polymer bonding process consisting of polymer patterning and bonding, and liquid-polymer filling. Furthermore, the grating was fabricated on the LSI circuit and the actuation of the grating by serial communication with the LSI circuit was demonstrated.
KW - LSI circuit
KW - monocrystalline silicon
KW - tunable grating
UR - http://www.scopus.com/inward/record.url?scp=84990231534&partnerID=8YFLogxK
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U2 - 10.1109/OMN.2016.7565878
DO - 10.1109/OMN.2016.7565878
M3 - Conference contribution
AN - SCOPUS:84990231534
T3 - International Conference on Optical MEMS and Nanophotonics
BT - 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
PB - IEEE Computer Society
T2 - 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
Y2 - 31 July 2016 through 4 August 2016
ER -