Abstract
A new raised source/drain (RSD) structure is proposed, which combines facet controlled in-situ-doped selective Si epitaxial growth (SEG) and solid-phase diffusion (SPD). This can provide ultra-shallow junctions without sacrificing the parasitic resistance, nor capacitance. 0.1μm pMOSFETs with 20nm deep junctions exhibiting excellent electrical characteristics and reliability were demonstrated. Compatibility with CMOS process was also confirmed.
Original language | English |
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Pages (from-to) | 174-175 |
Number of pages | 2 |
Journal | Digest of Technical Papers - Symposium on VLSI Technology |
Publication status | Published - 1996 Jan 1 |
Externally published | Yes |
Event | Proceedings of the 1996 Symposium on VLSI Technology - Honolulu, HI, USA Duration: 1996 Jun 11 → 1996 Jun 13 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering