TY - GEN
T1 - Universal parameter evaluating SiO2/SiC interface quality based on scanning nonlinear dielectric microscopy
AU - Chinone, Norimichi
AU - Nayak, Alpana
AU - Kosugi, Ryoji
AU - Tanaka, Yasunori
AU - Harada, Shinsuke
AU - Kiuchi, Yuji
AU - Okumura, Hajime
AU - Cho, Yasuo
N1 - Publisher Copyright:
© 2017 Trans Tech Publications, Switzerland.
PY - 2017
Y1 - 2017
N2 - Oxidized both silicon-face (Si-face) and carbon-face (C-face) wafers with various post-oxidation-annealing conditions were measured by scanning nonlinear dielectric microscopy (SNDM) and method for evaluating SiO2/SiC interface quality using SNDM was investigated. We found that the normalized standard deviation of SNDM image was good parameter to evaluate SiO2/SiC interface of Si and C-face. SNDM measurement does not need electrode fabrication to measure C-V curve, but needs just scan on the oxidized wafer with conductive tip, which is easier and quicker. This technique enables us to quickly examine the effect of variation of process parameters in MOS fabrication and to effectively reduce the time needed for R&D cycle.
AB - Oxidized both silicon-face (Si-face) and carbon-face (C-face) wafers with various post-oxidation-annealing conditions were measured by scanning nonlinear dielectric microscopy (SNDM) and method for evaluating SiO2/SiC interface quality using SNDM was investigated. We found that the normalized standard deviation of SNDM image was good parameter to evaluate SiO2/SiC interface of Si and C-face. SNDM measurement does not need electrode fabrication to measure C-V curve, but needs just scan on the oxidized wafer with conductive tip, which is easier and quicker. This technique enables us to quickly examine the effect of variation of process parameters in MOS fabrication and to effectively reduce the time needed for R&D cycle.
KW - Scanning nonlinear dielectric microscopy
KW - SiO/SiC interface
UR - http://www.scopus.com/inward/record.url?scp=85020080322&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85020080322&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.897.159
DO - 10.4028/www.scientific.net/MSF.897.159
M3 - Conference contribution
AN - SCOPUS:85020080322
SN - 9783035710434
T3 - Materials Science Forum
SP - 159
EP - 162
BT - Silicon Carbide and Related Materials 2016
A2 - Zekentes, Konstantinos
A2 - Zekentes, Konstantinos
A2 - Vasilevskiy, Konstantin V.
A2 - Frangis, Nikolaos
PB - Trans Tech Publications Ltd
T2 - 11th European Conference on Silicon Carbide and Related Materials, ECSCRM 2016
Y2 - 25 September 2016 through 29 September 2016
ER -