TY - GEN
T1 - UV-assisted intermittently-spinning ozone steam etching of SU-8 for micromolding process
AU - Yoshida, Shinya
AU - Suzuki, Kei
AU - Esashi, Masayoshi
AU - Tanaka, Shuji
PY - 2013
Y1 - 2013
N2 - This study reports on the usability of ultraviolet (UV)-assisted ozone steam etching for SU-8 removal in micromolding process. SU-8 is etched at a rate greater than 100 nm/min by intermittently rotating a substrate on a spinner with UV irradiation to spin out etching products. Its complete removability was also verified by analyzing the substrate surface after the ozone steam etching of SU-8 via scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). In a micromolding process, non-swelling removal of a 20-μm-thick SU-8 mold successfully left electroplated mushroom microstructures without destroying or residue. Such a structure cannot be released by conventional resist strippers, because it is lifted up due to resist swelling. Therefore, our new resist removal method is clearly demonstrated to have the usability and applicability for the micromolding process.
AB - This study reports on the usability of ultraviolet (UV)-assisted ozone steam etching for SU-8 removal in micromolding process. SU-8 is etched at a rate greater than 100 nm/min by intermittently rotating a substrate on a spinner with UV irradiation to spin out etching products. Its complete removability was also verified by analyzing the substrate surface after the ozone steam etching of SU-8 via scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). In a micromolding process, non-swelling removal of a 20-μm-thick SU-8 mold successfully left electroplated mushroom microstructures without destroying or residue. Such a structure cannot be released by conventional resist strippers, because it is lifted up due to resist swelling. Therefore, our new resist removal method is clearly demonstrated to have the usability and applicability for the micromolding process.
KW - Ozone steam etching
KW - SU-8
KW - micromolding process
UR - http://www.scopus.com/inward/record.url?scp=84891721880&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84891721880&partnerID=8YFLogxK
U2 - 10.1109/Transducers.2013.6627094
DO - 10.1109/Transducers.2013.6627094
M3 - Conference contribution
AN - SCOPUS:84891721880
SN - 9781467359818
T3 - 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
SP - 1621
EP - 1624
BT - 2013 Transducers and Eurosensors XXVII
T2 - 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Y2 - 16 June 2013 through 20 June 2013
ER -